pb rohs eccm1d-20-10.245m eccm1 d -20 -10.245m series rohs compliant (pb-free) 5.0mm x 7.0mm ceramic smd crystal frequency tolerance/stability 30ppm at 25c, 50ppm over -20c to +70c mode of operation at-cut fundamental nominal frequency 10.245mhz load capacitance 20pf parallel resonant electrical specifications nominal frequency 10.245mhz frequency tolerance/stability 30ppm at 25c, 50ppm over -20c to +70c aging at 25c 3ppm/year maximum load capacitance 20pf parallel resonant shunt capacitance (c0) 7pf maximum equivalent series resistance 60 ohms maximum mode of operation at-cut fundamental drive level 50watts maximum, 50watts correlation spurious response -3db minimum (measured from fo to fo +5000ppm) storage temperature range -40c to +85c insulation resistance 500 megaohms minimum (measured at 100vdc) environmental & mechanical specifications esd susceptibility mil-std-883, method 3015, class 1, hbm: 1500v fine leak test mil-std-883, method 1014, condition a flammability ul94-v0 gross leak test mil-std-883, method 1014, condition c mechanical shock mil-std-883, method 2002, condition b moisture resistance mil-std-883, method 1004 moisture sensitivity j-std-020, msl 1 resistance to soldering heat mil-std-202, method 210, condition k resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010, condition b vibration mil-std-883, method 2007, condition a mechanical dimensions (all dimensions in millimeters) pin connection 1 crystal 2 cover/ground 3 crystal 4 cover/ground line marking 1 e10.24 e=ecliptek designator 2 xxxxx xxxxx=ecliptek manufacturing identifier www.ecliptek.com | specification subject to change without notice | rev t 8/12/2010 | page 1 of 4 marking orient a tion 7.00 0.15 5.00 0.15 1.3 max 1.0 0.2 (x4) note: chamf er and inde x mar k not sho wn. 4.6 0.2 1.2 0.1 (x4) 2.54 0.20 2 3 4 1 2 3 4 1
eccm1d-20-10.245m 3.6 1.1 1.4 (x4) 2.2 (x4) www.ecliptek.com | specification subject to change without notice | rev t 8/12/2010 | page 2 of 4 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eccm1d-20-10.245m high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev t 8/12/2010 | page 3 of 4
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eccm1d-20-10.245m low temperature infrared/convection 240c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 240c maximum target peak temperature (tp target) 240c maximum 1 time / 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev t 8/12/2010 | page 4 of 4
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